Filp Chip Bonder & Hybrid Placer 상품리스트

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  • Filp Chip Bonder & Hybrid Placer

Product > Filp Chip Bonder & Hybrid Placer

  • 13,000UPH (Including processing time)
  • 4,500 UPH (0.8 sec/unit)
    The top mounting capability in Flipchip bonders
  • 6,000CPH (by direct pick-up, excellent wafer-barechip mounting tact)